Print ISSN: 1681-6900

Online ISSN: 2412-0758

Keywords : Heat dissipation

Experimental Investigation of Thermosyphon Thermal Performance Using Different Filling Ratio

Talib Z. Farge; Samar J. Ismael; Rawad M.Thyab

Engineering and Technology Journal, 2021, Volume 39, Issue 1A, Pages 34-44
DOI: 10.30684/etj.v39i1A.1639

The present work investigated the thermal performance of thermosyphon by using distilled water as a working fluid at different filling ratios (50%, 60%, and 70 %). The thermosyphon was manufactured from a copper tube with outer and inner diameters (26 and 24) mm, respectively. The thermosyphon was tested experimentally at different input power (100, 200 and 300) Watt. The operating temperature of the oil was chosen below 85°C. Experimental results revealed that the filling ratio of 60% exhibited the best heat dissipation at the highest operating temperature. While the low operating temperature and 50 % filling ratio show better heat dissipation. Further, it was found that the thermal resistance of the thermosyphon was obviously decreased with increasing the input power. The percentage decrease in the thermal resistance of the thermosyphon at a filling ratio of 0.6 was 14.6 % compared with that filling ratio of 0.5 at an input power of 300 W.

An Elaborate Review for Micro-Fin Heat Sink

Ibtisam A. Hasan; Sahar R. Fafraj; Israa A. Mohmma

Engineering and Technology Journal, 2020, Volume 38, Issue 1, Pages 105-112
DOI: 10.30684/etj.v38i1A.331

Heat sinks are low cost, the process of manufacturing reliability, and design simplicity which leads to taking into consideration various cutting-edge applications for heat transfer. Like stationary, fuel cells, automotive electronic devices also PV panels cooling and other various applications to improve the heat sinks thermal performance. The aim is to focus on some countless fundamental issues in domains such as; mechanics of fluids and heat transfer, sophisticated prediction for temperature distribution, high heat flux removal, and thermal resistance reduction. The outcome of this survey concluded that the best configuration of heat sinks has a thermal resistance about (0.140 K/W to 0.250 K/W) along with a drop of pressure less than (90.0 KPa) with a temperature gradient about 2 °C/mm. Heat sinks with square pin fins lead to enhance the effectiveness of heat dissipation than heat sinks with microcolumn pin fins. While other researches recommend the use of high conductive coating contains nano-particles. The present survey focuses on the researches about future heat sink with micro fin and the development to resolve the fundamental issues. The main benefits and boundaries of micro fins heat sink briefed.