Print ISSN: 1681-6900

Online ISSN: 2412-0758

Keywords : Epoxy resin


Study the Effect of adding Natural Rubber and Polymethyl Methacrylate to the Epoxy Resin on the Quantitative Analysis and its Mechanical Properties

S.E. Salih; W.M. Salih; M.A. Abdul hameed

Engineering and Technology Journal, 2017, Volume 35, Issue 2, Pages 163-171

From polymer blends can be obtained more useful properties compared with single polymer. In this work, polymer blend (Epoxy (EP): Natural Rubber (NR)) with different ratios of NR (0, 2, 3.5 and 5%wt) and ternary polymer blend with ratio of (Epoxy: 2%NR: 5% wt. PMMA) were prepared. The Mechanical properties were included (tensile, flexural, impact, compression) tests and analytical physical properties (FTIR, SEM) were investigated, and the results show that the elongation values, impact strength and fracture toughness for polymer blend system (Epoxy: NR) were increment with increase natural rubber ratio in the polymer blend system. Whereas fracture strength, young’s modulus, flexural strength, flexural modulus and maximum shear stress decreased. The highest values of impact strength and fracture toughness were (0.041KJ/m2) and (0.321 MPa √m) respectively for polymers blend (95% Epoxy: 5% NR). Ductile fracture in rubber modified epoxy may be produce from the elastomeric nature of rubber which is represents an energy dissipating center.

Cure Kinetics of Epoxy Resin Studied by Dynamics and Isothermal DSC Data

Adnan A. Abdul Razak; Najat j. Saleh; Maryem Emad

Engineering and Technology Journal, 2016, Volume 34, Issue 9, Pages 1731-1743

Diglycidyl ether of bisphenol A(DGEBA) epoxy resin was cured withhardeners aliphatic amine triethylenetetramine (TETA). Differential scanning calorimetry (DSC) technique was utilized to study the kinetics of cure of (DGEBA)-(TETA) system,diverse hardener/resin ratios werestudied, (5, 13and 20) phr. Isothermal as wellas dynamic experiments were carried out of the above mentioned DGEBA/TETA system with three hardener/resin ratios, and cure kinetics were investigated at four temperatures (30, 45, 60 and 80) °C using (DSC) technique. The process of isothermal cure was simulated by the diffusion model (modified Kamal’s model and four-parameter autocatalytic model. The obtainedoutcomes are in good agreement with the experimental results in the early andlate cure stages. The eventsdeclare that complete cure at 80 °C attains atthe stoichiometric ratio (13 phr).

Nano-SiO2 Addition Effect on Flexural Stress and Hardness of EP/MWCNT

E.A.Al-Ajaj; A.Sh. Alguraby; M.K. Jawad

Engineering and Technology Journal, 2015, Volume 33, Issue 7, Pages 1248-1257

Nano-SiO2 with different weight percentage (1,2 ,3, 4 and 5) % wt. , and 3% MWCNT were usedto fabricate nano-SiO2/MWNT/epoxy composite samples by hand layup method. Ultrasonic mixing processwas used to disperse the nano additives into the resin system. scanning electron microscopy (SEM)where usedto carry out the characteristic of fracture surface. By both the high aspect ratio and the very high modulus ofnano fillers. The mechanical properties of the composite with different weight percentages of nano-SiO2 havebeen investigated and After examine, the Scanning Electron Microscopy (SEM) explains well dispersednanotubes and SiO2 nano particles in the matrix. No evidence of agglomeration of the nanotubes can be foundin this micrographs. By adding SiO2 nano particles to epoxy/MWCNT composite, this would dramaticallyimprove the bending properties and The Young’s modulus has been doubled and quadrupled for compositeswith respectively 2 and 4 wt.% nano SiO2, compared to the pure resin matrix samples (3.36 ,4.06 ,and 1.59 )GPa respectively .While flexural strength has been increased in random manner with maximum value for 2 wt%(111 MPa). The hardness of nano composite increased with increase of SiO2 filler loading, it can be seen thatthe SiO2 filler greatly increased the hardness, which can be attributed to the higher hardness and moreuniform dispersion of SiO2 filler. The higher hardness is exhibited by the 5 wt% SiO2 filled compared to othernanocomposites. The results show that at 5wt% nano SiO2 content there is 11% increase in hardness

Study of the Cure Reaction of Epoxy Resin Diglycidyl Ether of Bisphenol-A (DGEBA) with Meta- Phenylene Diamine

Najat J. Salah; Bashar J. Kadhim

Engineering and Technology Journal, 2013, Volume 31, Issue 9, Pages 1658-1673

The cure process of epoxy resin diglycidyl ether of bisphenol-A (DGEBA) with aromatic amine (m-PDA) as curing agent was studied by means of differential scanning calorimetry (DSC) Perkin Elmer Pyris 6, at ratio (15 phr). Isothermal DSC measurements were conducted between 80 and 110 oC, at 10 oC intervals. The maximum degree of cure at isothermal cure temperature 110 oC was 0.9. The isothermal cure process was simulated with Kamal modifier with diffusion model, the model agrees well with the experimental data. For dynamic cure process, the activation energy was determined by two methods. One was based on Kissinger and Ozawa approach, given only one activation energy for the whole curing process. There was a slightly difference between the obtained activation energy and pre-exponential factor, 63.6 and 70.7 kJ mol-1 respectively. Another method was based on isoconversional, given activation energy at any conversion, and observed the Ea decrease with increment conversion (67-63) KJ/mol.