Engineering and Technology Journal

An Elaborate Review for Micro-Fin Heat Sink

Document Type : Review Paper

Authors

1 Electromechanical Engineering Department, University of Technology, Baghdad. 50255@uotechnology.edu.iq

2 Electromechanical Engineering Department, University of Technology, Baghdad. dr.sahar_alsakini@yahoo.com

3 Electromechanical Engineering Department, University of Technology, Baghdad. israaalrkaby@gmail.com

Abstract

Heat sinks are low cost, the process of manufacturing reliability, and design simplicity which leads to taking into consideration various cutting-edge applications for heat transfer. Like stationary, fuel cells, automotive electronic devices also PV panels cooling and other various applications to improve the heat sinks thermal performance. The aim is to focus on some countless fundamental issues in domains such as; mechanics of fluids and heat transfer, sophisticated prediction for temperature distribution, high heat flux removal, and thermal resistance reduction. The outcome of this survey concluded that the best configuration of heat sinks has a thermal resistance about (0.140 K/W to 0.250 K/W) along with a drop of pressure less than (90.0 KPa) with a temperature gradient about 2 °C/mm. Heat sinks with square pin fins lead to enhance the effectiveness of heat dissipation than heat sinks with microcolumn pin fins. While other researches recommend the use of high conductive coating contains nano-particles. The present survey focuses on the researches about future heat sink with micro fin and the development to resolve the fundamental issues. The main benefits and boundaries of micro fins heat sink briefed.

Keywords

References
 
[1]   M. Bezaatpour, GM. oharkhah, “A novel heat sink design for simultaneous heat transfer enhancement and pressure drop reduction utilizing porous  fins and magnetite ferrofluid,” International Journal of Numerical Methods for Heat & Fluid Flow, 2019. Available: https://doi.org/10.1108/HFF-12-2018-0810
[2]   A. H. Ibtisam, S. Iman. A. Duha., “Effect of evaporative cooling combined with heat sink on PV module performance,” Journal of University of Babylon for Engineering Sciences, Vol. 27, No. 2, 2019.
[3]   M. L. Roukes and S. Fritz, “Understanding Nanotechnology,” Scientific American, 2002.
[4]   A. Dewan, P. Mahanta, K. S. Raju, P.S.Kumar, “Review of passive heat transfer augmentation techniques,” Proc. Inst. Mech. Eng. A: J. Power Energy, 218, 7, 509–527, 2004.
[5]   K .H. Dhanawade, V. K. Sunnapwar, H. S. Dhanawade, “Optimization of design parameters for lateral circular perforated fin arrays under forced convection,” Heat. Trans. Asian, 34, 7, 1–16, 2014.
[6]   A. Amer, S. Fahad, “Heat transfer and airflow characteristics enhancement of compact plate-pin fins heat sinks – a review,” Propulsion and Power Research, 2, 38–146, 2018.
[7]   S. Mahmoud, R. Al-Dadah, D.K. Aspinwall, S.L. Soo, H. Hemida, “Effect of micro fin geometry on natural convection heat transfer of horizontal microstructures,” Appl. Therm. Eng., 627-633, 2011 .
[8]   J.S. Kim, BK. Park, JS. Lee,”Natural convection heat transfer around micro fin arrays,” Experimental Heat Transfer, 21, 55–72, 2008.
[9]   M. Bopp, P. Coronel, C. Hibert and A. M.  Ionescu, “3D stacked arrays of fins and nanowires on bulk silicon Microelectron,” Eng., 871348–51, 2010.
[10] F. Lärmer, S. Franssila, L. Sainiemi, and K. Kolari, “Deep reactive ion etching,” in V. Lindroos, M. Tilli, A. Lehto, and T. Motooka (Eds.), “Handbook of Silicon Based MEMS Materials and Technologies, William Andrew/Elsevier, 2010.
[11] S. G. Kandlikar, “High flux heat removal with microchannels—a roadmap of challenges and opportunities,” Heat Transfer Engineering, vol. 26, no. 8, 5–14, 2005.
[12] M. Golnoosh, “Natural convective heat transfer from interrupted rectangular fins,” M.Sc. dissertation, School of Engineering Science, Faculty of Applied Sciences, Simon Fraser University, 2012.
[13] M.R. Shaeri, M. Yaghoubi, “Numerical analysis of turbulent convection heat transfer from an array of perforated fins,” Int. J. Heat.FluidFlow, 30, 2, 218–228, 2009.
[14] T.J. John, B. Mathew, H. Hegab, “Parametric study on the combined thermal and hydraulic performance of single phase micro pin-fin heat sinks part I: Square and circle geometries,” International Journal of Thermal Sciences, Volume 49, Issue 11, November, pp 2177-2190, 2010.
[15] O.N. Sara, T. Pekdemir, S. Yapici, H. Ersahan, “Thermal performance analysis for solid and perforated blocks attached on a flat surface induct flow,” Energy Convers. Manage. 41, 10, 1010–1028, 2012.
[16] P. Naphon, S. Wiriyasart, “ Liquid cooling in the mini- rectangular fin heat sink with and without thermoelectric for CPU,” Int. Commun. Heat Mass Transf, 36, 2, 166–171, 2009.
[17] Y. T. Yang, H. S. Peng, “Investigation of planted pin fins for heat transfer enhancement in plate fin heat sink, Microelec- tron,” Reliab.49, 2, 163–169, 2009.
[18] B A.  Shakouri, “Nanoscale Thermal Transport and Micro refrigerators on a Chip,” Proceedings of the IEEE, Vol. 94, No. 8, 1613–1638, 2006.
[19] Y. Taihoeom, T. Simon, T. Zhang, M. Zhang, M. North, T. Cui, “Enhanced heat transfer of heat sink channels with micro pin fin roughened walls,” International Journal of Heat and Mass Transfer, Vol. 92, 617-627, 2016.
[20] J. Zhao, S. Huang, L. Gong, Z. Huang, “Numerical study and optimizing on micro square pin-fin heat sink for electronic cooling,” Applied Thermal Engineering, Vol. 93, 1347-1359, 2016.
[21] A. Carlos,  R.Jimenez, G. K. Satish, and A. H.Guerrero, “Numerical Analysis of Novel Micro Pin Fin Heat Sink with Variable Fin Density,”
IEEE transactions on components, packaging andmanufacturing technology, Vol. 2, No. 5, pp 825-833, May, 2012.
[22] A. Abdoli, G. Jimenez, S. D.George, “Thermo-fluid analysis of micro pin-fin  array cooling configurations for high heat fluxes with a hot spot,”  International  Journal  of  Thermal Sciences, Vol. 90, 290-297, 2015.
[23] D. A. McNeil, A. H. Raeisi, P.A. Kew, R. S. Hamed, “An investigation into flow boiling heat transfer and pressure drop in a pin-finned heat sink, “International Journal of Multiphase Flow, Vol. 67, Supplement, 65-84, 2014.
[24] Y. Peles,  A. Koar,  C. Mishra, C. J. Kuo, B. Schneider, “Forced convective heat transfer across a pin fin micro heat sink, “International Journal of Heat and Mass Transfer, Vol. 48, Issue 17, 3615-3627, 2005.
[25] H. Shokouhmand and H, Ahmad, “Heat Transfer from a micro fin array heat sink by natural convection and radiation under slip flow regime,” In: Proceedings of the world congress on engineering, 2010.
[26] G. Oguntala, R. Abd-lhmeed, G. Sobamowo, “Improved thermal mangment of computer microprocessors using cylindrical-coordinate micro-fin heat sink with artificial surface roughness,” Engineering Science and Technology, an International Journal, 2018.
Engineering and Technology Journal
Volume 38, 1A
January 2020
Page 105-112
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