[1] L. T. Yeh, Review of heat transfer technologies in electronic equipment, J. of electron, 117 (1995) 333-339.
[2] H. Y. Zhang, Y. C., Mui, and M. Tarin, M. Analysis of thermoelectric cooler performance for high power electronic packages. Applied thermal engineering, 30 (2010) 561-568.
[3] J. Holman, Heat transfer tenth edition. The McGraw-Hill Companies. U.S.A. 2010
[4] S., Kumar, and A. Tariq. Steady state experimental investigation of thermal contact conductance between curvilinear contacts using liquid crystal thermography. International Journal of Thermal Sciences, 118 (2017) 53-68.
[5] Y., Xian, P. Zhang, S. Zhai, P. Yuan, and D. Yang. Experimental characterization methods for thermal contact resistance: A review. Applied Thermal Engineering, 130 (2018) 1530-1548.
[6] Y. Jeng, J. Chen, and C. Cheng. Theoretical and experimental study of a thermal contact conductance model for elastic, elastoplastic and plastic deformation of rough surfaces. Tribology Lett; 14:251e9, 2003.
[7] C. V. Madhusudana. Thermal conductance of cylindrical joints. International Journal of Heat and Mass Transfer, 42 (1999) 1273-1287.
[8] J. M. Jalil. & S. J. Habeeb, Mixed Convection from Electronic Equipment Component at Different Position at Enclosure by Primitive Variables Method. Journal of Engineering, 12 (2006).
[9] B.Sarper, M. Saglam. & O.Aydin. Experimental and numerical investigation of natural convection in a discretely heated vertical channel: Effect of the blockage ratio of the heat sources. International Journal of Heat and Mass Transfer, 126, 894-910, 2018.
[10] A.Dogan, M. Sivrioglu, and S. Baskaya, Investigation of mixed convection heat transfer in a horizontal channel with discrete heat sources at the top and at the bottom. International Journal of Heat and Mass Transfer, 49 (2006) 2652-2662.
[11] H.Laouira, F. Mebarek‐Oudina, Hussein, A. K., Kolsi, L., Merah, A., & Younis, O. Heat transfer inside a horizontal channel with an open trapezoidal enclosure subjected to a heat source of different lengths. Heat Transfer—Asian Research, 49(2020) 406-423.
[12] S.Durgam, S. P. Venkateshan, and T. Sundararajan, Experimental and numerical investigations on optimal distribution of heat source array under natural and forced convection in a horizontal channel. International Journal of Thermal Sciences, 115 (2017) 125-138.
[13] M.Shim, M. Y.Ha, and J. K. Min. A numerical study of the mixed convection around slanted-pin fins on a hot plate in vertical and inclined channels. International Communications in Heat and Mass Transfer, 118 (2020) 104878.
[14] A. M. Anderson, and R. J. Moffat. Direct air cooling of electronic components: reducing component temperatures by controlled thermal mixing: J. of Heat Transfer, 113 (1991) 56-62.
[15] I. Y.Hussain and H. S. Abdulla. Optimization of Thermal Layout Design of Electronic Equipment's on the Printed Circuit Board. Journal of Engineering, 12 (2006).
[16] B. Sarper, M. Saglam and O.Aydin. Experimental and numerical investigation of natural convection in a discretely heated vertical channel: Effect of the blockage ratio of the heat sources. International Journal of Heat and Mass Transfer, 126 (2018) 894-910.
[17] R.Grimes, M.Davies, J. Punch, and T. Dalton, & R. Cole. Modeling electronic cooling axial fan flows. J. Electron. Packag. 123(2001) 112-119.
[18] J. M. Jalil. Numerical and Experimental Study of Cooling in Desktop Computer with Block Heat Sink. Engineering and Technology Journal, 36 (2018).
[19] O. Manca, S. Nardini, K. Khanafer, K. Vafai. Effect of heated wall position on mixed convection in a channel with an open cavity. Num Heat Transfer A.; 43(2003) 259‐282.
[20] V. Cardenas, C. Trevino, I. Rosas, L. Martinez‐Suastegui. Experimental study of buoyancy and inclination effects on transient mixed convection heat transfer in a channel with two symmetric open cubic cavities with prescribed heat flux. Int J Therm Sci ;140: (2019) 71‐86.
[21] R.Lucchese, D. Varagnolo, and A. Johansson. Controlled Direct Liquid Cooling of Data Servers. IEEE Transactions on Control Systems Technology, 2020.
[22] G. Liang, and I. Mudawar. Review of pool boiling enhancement by surface modification. International Journal of Heat and Mass Transfer, 128 (2019) 892-933.
[23] Lee, M. Mahalingam, and P.J.C. Normington. Subcooled pool boiling critical heat flux in dielectric liquid mixtures: (1993)134-137.
[24] Q. Jin, J. T., and Wen, S. Narayanan. Dynamic control of pressure drop oscillation in a microchannel cooling system. Heat Transfer Engineering, (2020)1-16.
[25] A. A.Imran, N. S. Mahmoud, and H. M. Jaffar. Numerical and experimental investigation of heat transfer in liquid cooling serpentine mini-channel heat sink with different new configuration models. Thermal Science and Engineering Progress, 6 (2018) 128-139.
[26] W. W.Wits, T. H. Vaneker, J. H. Mannak, and R. Legtenberg. Novel cooling strategy for electronic packages: Directly injected cooling. C.I.R.P. journal of manufacturing science and technology, 1(2009) 142-147.
[27] P.Naphon, and S. Wongwises. Investigation on the jet liquid impingement heat transfer for the central processing unit of personal computers. International Communications in Heat and Mass Transfer, 37 (2010) 822-826.
[28] B. Abdullahi, & R. K. Al-dadah. Thermosyphon heat pipe technology. In Recent Advances in Heat Pipes. Intech Open., 2019.
[29] W. Wits, R. Legtenberg, J. Mannak, and B.van Zalk, (2006, November). Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology, Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (2006) 55-61.
[30] Y. Z.Ling, X. S.Zhang, F. Wang, & X. H. She. Performance study of phase change materials coupled with three-dimensional oscillating heat pipes with different structures for electronic cooling. Renewable Energy, 154 (2020) 636-649.
[31] M.S. Dresselhaus, G. Chen, M.Y. Tang, R.G. Yang, H. Lee, D.Z. Wang, et al., New directions for low-dimensional thermoelectric materials, Adv. Mater. 19 (2007) 1043–1053.
[32] Y. Cai, Y.Wang, D. Liu, and F. Y. Zhao. Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments. Applied Thermal Engineering, 148 (2019) 238-255.
[33] Y. CAI, D.-D. Zhang, D. Liu, F.-Y. Zhao, H.-Q. Wang, Air source thermoelectric heat pump for simultaneous cold air delivery and hot water supply: full modeling and performance evaluation, Renew. Energy 130 (2019) 968–981.
[34] Y. Zhou, T.Zhang, F.Wang, and Y.Yu. Performance analysis of a novel thermoelectric assisted indirect evaporative cooling system. Energy, 162 (2018) 299-308.
[35] A. M.Iqbal, M. S. A.Aziz, M. Z.Abdullah, & M. H. H. Ishak, (2019, June). Temperature Prediction on Flexible Printed Circuit Board in Reflow Oven Soldering for Motherboard Application. In I.O.P. Conference Series: Materials Science and Engineering 530 (2019) 012019. I.O.P. Publishing.
[36] L. C.Hooi, M. Z.Abdullah, & I. A. Azid, (2017, March). Numerical simulation of fluid-structure interaction on flexible P.C.B. with multiple ball grid array components. In A.I.P. Conference Proceedings 1818 (2017) 020018. A.I.P. Publishing L.L.C.
[37] C. H.Lim, M. Z.Abdullah, I. A. Azid, and C. Y. Khor. Heat transfer enhancement by flexible printed circuit board's deformation. International Communications in Heat and Mass Transfer, 84 (2017) 86-93.
[38] C. H.Lim, M. Z. Abdullah, I. A. Azid, C. Y. Khor, M. A. Aziz, and M. H. H. Ishaik, . Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects. Circuit World., 2020.
[39] C. H.Lim, M. Z.Abdullah, I. A. Azid, and C. Y. Khor. The effect of freestream flow velocities on the flexible printed circuit board with different BGA package arrangements. Arabian Journal for Science and Engineering, 42 (2017) 2075-2086.