Laser-Induced Forward Transfer (LIFT) is a technique which enables the
controlled transfer of a thin film material from a transparent carrier (donor) to a
receiver substrate (acceptor). The receiver substrate is usually placed in parallel
and close to the thin film source under air or vacuum conditions. In this work
microdeposition of gold (Au) and Copper (Cu) thin films were deposited on glass
substrate by Pulsed Laser Deposition (PLD). These thin films were irradiated by a
single pulse and transferred to a silver (Ag) and silicon (Si) receiver substrates. The
laser source used for this study was a Nd-YAG Q-Switching second harmonic
generation (SHG) Pulsed Laser with a wavelength 532nm, repetition rate 1-6 Hz
,and pulse duration 10ns. Deposited size, morphology and adhesion to the receiver
substrate as a function of applied laser fluence are investigated.