Study of the Cure Reaction of Epoxy Resin Diglycidyl Ether of Bisphenol-A (DGEBA) with Meta- Phenylene Diamine
Engineering and Technology Journal,
2013, Volume 31, Issue 9, Pages 1658-1673
AbstractThe cure process of epoxy resin diglycidyl ether of bisphenol-A (DGEBA) with aromatic amine (m-PDA) as curing agent was studied by means of differential scanning calorimetry (DSC) Perkin Elmer Pyris 6, at ratio (15 phr). Isothermal DSC measurements were conducted between 80 and 110 oC, at 10 oC intervals. The maximum degree of cure at isothermal cure temperature 110 oC was 0.9. The isothermal cure process was simulated with Kamal modifier with diffusion model, the model agrees well with the experimental data. For dynamic cure process, the activation energy was determined by two methods. One was based on Kissinger and Ozawa approach, given only one activation energy for the whole curing process. There was a slightly difference between the obtained activation energy and pre-exponential factor, 63.6 and 70.7 kJ mol-1 respectively. Another method was based on isoconversional, given activation energy at any conversion, and observed the Ea decrease with increment conversion (67-63) KJ/mol.
- Article View: 205
- PDF Download: 117